Method and apparatus controlling dual heat transfers for internal thermal zone of a hard disk drive

ABSTRACT

Method and apparatus (thermal controller) for controlling a thermoelectric device to affect the temperature of an internal thermal zone in a hard disk drive to enable a first heat transfer from an internal heat transfer interface included in a thermal interface to an exterior heat transfer interface thermally coupling to the exterior of said hard disk drive, and applying to enable a second heat transfer from the exterior heat transfer interface to the internal heat transfer interface. The thermoelectric device may include the thermal controller. An external cover may include the thermal controller. The hard disk drive includes the thermal controller directing the thermoelectric device. Systems including at least one of the hard disk drives. Manufacturing these apparatus and these apparatus as products of these processes are part of the invention.

CROSS REFERENCE TO RELATED APPLICATIONS

This patent application is a continuation-in-part application of pendingpatent application Ser. No. 11/323,624, filed Dec. 30, 2005, whichpending application is incorporated herein by reference in its entirety.

TECHNICAL FIELD

This invention relates to hard disk drive components, in particular, tomechanisms to regulate and control the internal ambient temperatureinside a hard disk drive.

BACKGROUND OF THE INVENTION

Contemporary hard disk drives are faced with severe challenges. Theymust operate wherever their users decide to operate them, inenvironments where the hard disk drive must operate outside of roomtemperature.

When a hard disk drive is too hot, many operating problems develop. Heattends to decay the material of the rotating disk surfaces on which thedata is stored. The mechanical component tolerances degrade due todifferences in their coefficients of thermal expansion. The pressure atthe air bearing surface will change due to the high temperature. Thebreakdown of lubricants used in the hard disk drive is accelerated. Thesensitivities due to thermal asperities during read operations isincreased. The effects of thermal pole tip protrusion are maximized.

When the hard disk drive is too cold, other operating problems develop.The thermal coercivity of the disk media is lowered, degrading theability to write data to tracks on the disk surfaces. The pressure atthe air bearing surface will change due to the low temperature. It takeslonger to start up the hard disk drive when it is cold, due to theviscosity of the lubricant in the spindle motor. The effects of thermalpole tip protrusion are minimized.

Today, many hard disk drives include some device measuring the internaltemperature, and in some situations, the operating parameters of thehard disk drive are altered based upon the measured internaltemperature. In many hard disk drives, at least part of the exteriorface of the disk base is configured as a primitive thermal transferelement. However, no hard disk drives are known to be able to adjusttheir internal temperature. What is needed is a hard disk drive ableadjust its internal temperature toward its optimal operating temperaturerange.

SUMMARY OF THE INVENTION

Definitions: Heat transfer interface as used herein means any passagewayfor heat transfer. Thermal-couple as used herein refers to a layer ofmaterial between adjacent transfer interfaces which assists the transferof heat between the transfer interfaces; typically but not necessarilyan adhesive material. Thermal-coupling as used herein describes theaction of providing a passageway for heat transfer.

The invention includes controlling a thermoelectric device to affect thetemperature of an internal thermal zone in a hard disk drive. Thisincludes

-   -   Applying a first potential difference between an electrical        contact pair to enable a first heat transfer from an internal        heat transfer interface included in a thermal interface to an        exterior heat transfer interface thermally-coupling to the        exterior of the hard disk drive to cool the hard disk drive.    -   The thermal interface is thermally coupled to the internal        thermal zone of the hard disk drive.    -   And applying a second potential difference between the        electrical contact pair to enable a second heat transfer from        the exterior heat transfer interface to the internal heat        transfer interface to heat the hard disk drive.    -   The sign of the first potential difference is the opposite of        the sign of the second potential difference.    -   The first heat transfer and the second heat transfer are the        products of this process.

The internal thermal zone may preferably include at least one disksurface, and may preferably further include all the disk surfaces andsliders moving near the disk surfaces.

Controlling the thermoelectric device may be based upon a temperaturemeasure.

-   -   Applying the first potential difference may include applying the        first potential difference between the electrical contact pair,        when the temperature measure is above a top operating        temperature.        -   The temperature measure may be above the top operating            temperature when the temperature measure is greater than the            top operating temperature.        -   Alternatively, the temperature measure may be above the top            operating temperature when the temperature measure is            greater than or equal to the top operating temperature.    -   Applying the second potential difference may include applying        the second potential difference when the temperature measure is        below the bottom operating temperature.        -   The temperature measure may be below the bottom operating            temperature, when the temperature measure is less than the            bottom operating temperature.        -   Alternatively, the temperature measure may be below the            bottom operating temperature, when the temperature measure            is less than or equal to the bottom operating temperature.

A driving signal may be applied to the electrical contact pair.

-   -   Applying a first potential difference between an electrical        contact pair to enable a first heat transfer from an internal        heat transfer interface included in a thermal interface to an        exterior heat transfer interface thermally coupling to the        exterior of the hard disk drive.    -   And applying a second potential difference between the        electrical contact pair to enable a second heat transfer from        the exterior heat transfer interface to the internal heat        transfer interface.

A thermal controller may implement the control method. The thermalcontroller may include the following.

-   -   Means for applying the first potential difference between the        electrical contact pair to enable the first heat transfer from        the internal heat transfer interface to the exterior heat        transfer interface.    -   And means for applying the second potential difference between        the electrical contact pair to enable the second heat transfer        from the exterior heat transfer interface to the internal heat        transfer interface.    -   The thermal controller may also receive a signal from the drive        firmware to enable or disable one or both of these means.

The thermal controller may receive the temperature measure for theinternal thermal zone of the hard disk drive.

-   -   The means for applying the first potential difference may        further include        -   A first means for forcing the driving signal toward the            first potential difference between the electrical contact            pair, when the temperature measure is above the top            operating temperature.    -   The means for applying the second potential difference may        further include        -   A second means for forcing the driving signal toward the            second potential difference between the electrical contact            pair, when the temperature measure is below the lower            operating temperature.

The thermal controller may include at least one of the following.

-   -   A finite state machine generating a digital version of the        driving signal based upon the temperature measure.    -   A computer accessibly coupled to a memory containing a program        system including at least one program step generating a second        digital version of the driving signal based upon the temperature        measure.    -   A neural network responding to the temperature measure to        generate a third digital version of the driving signal.

The thermal controller may further include exactly one of the finitestate machine, the computer and the neural network.

The program system may include at least one of the following programsteps

-   -   Forcing the second digital version of the driving signal toward        the first potential difference.    -   And forcing the second digital version of the driving signal        toward the second potential difference.

The program system may include a program step implementing the neuralnetwork responding to the temperature measure to generate the thirddigital version of the driving signal.

The thermal controller may include an analog circuit generating thedriving signal based upon at least one of the temperature measure, thedigital version of the driving signal, the second digital version of thedriving signal, and the third digital version of the driving signal. Theanalog circuit may further generate the driving signal based uponexactly one of these.

The analog circuit may include one or both of the following or theirrefinements as discussed elsewhere in this document.

-   -   Means for applying the first potential difference between the        electrical contact pair to enable the first heat transfer from        the internal heat transfer interface to the exterior heat        transfer interface.    -   And means for applying the second potential difference between        the electrical contact pair to enable the second heat transfer        from the exterior heat transfer interface to the internal heat        transfer interface.

Pulse-width-modulation may be employed.

-   -   Forcing the driving signal toward the first potential difference        may preferably include pulse-width-modulating the driving signal        between the first potential difference and zero volts,        preferably based upon the temperature measure.    -   Forcing the driving signal toward the second potential        difference may preferably include pulse-width-modulating the        driving signal between the second potential difference and zero        volts, preferably based upon the temperature measure.

Manufacturing the thermal controller may include at least one of thefollowing:

-   -   Providing the means for applying the first potential difference        and the means for applying the second potential difference to at        least partly create the thermal controller.    -   Providing        -   A means for forcing a driving signal toward the first            potential difference between the electrical contact pair,            when a temperature measure is above a top operating            temperature,        -   A means for forcing the driving signal toward the second            potential difference between the electrical contact pair,            when the temperature measure is below a lower operating            temperature        -   to at least partly create the thermal controller.    -   Providing at least one finite state machine generating a digital        version of the driving signal to at least partly create the        thermal controller.    -   Providing at least one computer generating a second digital        version of the driving signal to at least partly create the        thermal controller.    -   Providing a neural network generating a third digital version of        the driving signal to at least partly create the thermal        controller.    -   Providing the program system in the memory to at least partly        create the thermal controller.    -   Providing the analog circuit to at least partly create the        thermal controller.

The thermal controller is a product of the manufacturing process.

The thermoelectric device may include the thermal controller providingthe driving signal to the electrical contact pair of the thermoelectricdevice.

-   -   The thermoelectric device may include at least one semiconductor        device acting as a heat pump and using the transfer interface to        thermally-affect the internal thermal zone.

The invention includes an external cover of the hard disk drive mayinclude the thermal controller receiving a temperature measure of theinternal thermal zone and providing a driving signal to the firstelectrical contact pair of the thermoelectric device.

-   -   The external cover may further include the thermoelectric        device.    -   A disk cover and/or a disk base may serve as the external cover        for the hard disk drive.

The external cover may further include a second electrical contact pairdriving a fan motor powering a fan to move air across a thermal transferelement exterior to the hard disk drive.

-   -   The thermal controller may further provide a fan driving signal        to the second electrical contact pair.    -   The thermal controller may preferably provide the fan driving        signal with at least one fan potential difference distinct from        zero volts, when the temperature measure is either above the top        operating temperature or below the bottom operating temperature.    -   The fan driving signal may be at least temporarily a Direct        Current (DC) signal and/or an Alternating Current (AC) signal.

The invention includes the hard disk drive, including the thermalcontroller directing the thermoelectric device.

-   -   Preferably, the thermal controller provides the driving signal        to the electrical contact pair to direct a thermoelectric device        in the first heat transfer and in the second heat transfer.

The invention includes a system comprising at least one of the hard diskdrives controlling the temperature of an internal thermal zone in thehard disk drive.

-   -   These systems include, but are not limited to, a Redundant        Arrays of Inexpensive Disks (RAID), a server computer, a desktop        computer, and a notebook computer.

The invention includes manufacturing the hard disk drive and the harddisk drive as a product of the manufacturing process. The inventionincludes manufacturing the system using the hard disk drives and thesystem as a product of the manufacturing process.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1 to 3 shows controlling the internal thermal zone of a hard diskdrive by moving heat into or out of its internal thermal zone;

FIG. 4 shows some of the various aspects of the internal thermal zone ofFIGS. 1 to 3;

FIGS. 5 to 8C show various aspects of the external cover with thetransfer interface of FIGS. 1 to 3 with regards to the hard disk drive;

FIGS. 9A, 11A and 11E show details of the external cover and/or thethermoelectric device of the previous Figures including a thermalcontroller;

FIGS. 9B to 10A show various aspects of the thermal controller;

FIGS. 10B, 10C, 11B, 11C, 11D, and 12A to 12F show flowcharts discussingsome of the operational aspects of the external cover;

FIGS. 13A to 13I show various aspects of systems using the hard diskdrives of the invention; and

FIGS. 14A and 14B show some alternative embodiments of the semiconductordevice of the previous Figures;

FIGS. 15A to 17A show further aspects of the thermal controller; and

FIG. 17B show a further aspect of systems using the hard disk drives ofthe invention.

DETAILED DESCRIPTION

This invention relates to hard disk drive components, in particular, tomechanisms to regulate and control the internal ambient temperatureinside a hard disk drive.

The invention includes controlling a thermoelectric device 200 to affectthe temperature of an internal thermal zone 20 in a hard disk drive 10,as shown in FIGS. 1 to 3. This includes

-   -   Applying a first potential difference V1 between an electrical        contact pair 210 to enable a first heat transfer 120 from an        internal heat transfer interface 130 included in a intermediate        thermal intermediate thermal transfer interface 110 to an        exterior heat transfer interface 132 thermally coupling to the        exterior 300 of the hard disk drive, as shown in FIG. 3.    -   The thermal interface is thermally coupled to the internal        thermal zone of the hard disk drive.    -   And applying a second potential difference V2 between the        electrical contact pair to enable a second heat transfer 122        from the exterior heat transfer interface to the internal heat        transfer interface, as shown in FIG. 2.    -   The sign of the first potential difference is the opposite of        the sign of the second potential difference.    -   The first heat transfer and the second heat transfer are the        products of this process.

A thermal controller 500 may implement the control method, as shown inFIG. 7A to 12F.

Controlling the thermoelectric device 200 may be based upon atemperature measure 510, as shown in FIGS. 9A to 10C and 12C to 12F.

-   -   Applying the first potential difference V1 may include applying        the first potential difference between the electrical contact        pair 210, when the temperature measure is above a top operating        temperature 512.    -   Applying the second potential difference V2 may include applying        the second potential difference when the temperature measure is        below the bottom operating temperature 514.

The invention includes the external cover 100 for the hard disk drive 10including the thermal controller 500 as shown in FIGS. 9A and 11E. Adisk cover 16 and/or a disk base 14 may serve as the external cover forthe hard disk drive as shown in FIGS. 5 to 7C.

The thermoelectric device 200 may preferably provide two heat transfersacross the intermediate thermal transfer interface 110 to the exterior300 of the hard disk drive 10, into the internal thermal zone 20 to warmit, and out of the internal thermal zone to cool it, as shown in FIG. 1.The thermoelectric device 200 may preferably provide a first heattransfer 120 across the transfer interface from the internal thermalzone to the exterior of the hard disk drive to cool it as shown in FIG.3. The thermoelectric device also provides a second heat transfer 122from the exterior to the internal thermal zone to warm the internalthermal zone as shown in FIG. 2. The thermoelectric device preferablyincludes the means for enabling power 240 from the electrical contactpair for the first thermal transfer and for the second thermal transfer.The means for enabling power may preferably include at least onesemiconductor device 250.

The internal thermal zone 20 may preferably include at least one disksurface 12-1, and may preferably further include each disk 12, each disksurface 12-1 and each slider 90 moving near the disk surfaces as shownin FIG. 4. The internal thermal zone may further include the head gimbalassembly 60 including the slider. The internal thermal zone may furtherinclude the actuator arm 52 including the head gimbal assembly, likewisethe actuator assembly 50 and the voice coil motor 30. The internalthermal zone may also include the spindle 82 and/or the spindle motor 80as shown in FIGS. 7A, 7B, 8A, and 8B.

The intermediate thermal transfer interface 110 may provide a nearlyplanar surface to the thermoelectric device 200, as shown in FIGS. 1 to3, and 5 to 7B. The planar surface may have a surface area of at leastone square inch, and may further be at most four square inches.

The external cover 100 may further include the thermoelectric device 200providing an exterior heat transfer interface 132 thermal-coupling tothe exterior 300 of the hard disk drive 10 through a secondthermal-couple 134. The thermoelectric device may include an internalheat transfer interface 130 thermal-coupling to the intermediate thermaltransfer interface 110 through a thermal-couple 112. The secondthermal-coupling may further preferably be to air 150 exterior 300 tothe hard disk drive 10.

The thermoelectric device 200 may preferably include an electricalcontact pair 210 providing enabling power for a first heat transfer 120from the intermediate thermal transfer interface 110 including theinternal heat transfer interface 130 to the exterior heat transferinterface 132, and a second heat transfer 132 from the exterior heattransfer interface to the transfer interface. Preferably, applying afirst potential difference V1 between the electrical contact pair 210enables the first heat transfer as shown in FIG. 2, and applying asecond potential difference V2 between the electrical contact pairenables the second heat transfer as in FIG. 3. Preferably, the sign ofthe first potential difference is opposite the sign of the secondpotential difference.

The thermoelectric device 200 includes at least one semiconductor device250 acting as a heat pump and using the intermediate thermal transferinterface 110 to thermally-affect the internal thermal zone 20, as shownin FIGS. 1 to 3. The thermoelectric device may use the transferinterface to move heat out of the internal thermal zone, which will tendto thermally-affect the internal thermal zone by lowering itstemperature, as shown in FIG. 2. Also, the thermoelectric device may usethe transfer interface to move heat into the internal thermal zone,tending to thermally-affect the internal thermal zone by raising itstemperature, as shown in FIG. 3.

The semiconductor device 250 preferably includes a first semiconductorterminal 252-1 electrically coupled to a first electrical contact 210-1,and a second semiconductor terminal 252-2 electrically coupled to asecond electrical contact 210-2. The electrical contact pair 210preferably consists essentially of the first electrical contact and thesecond electrical contact. The electrical contact pair may also beconsidered to include electrical insulation and conductive paths, whichdo not change the essential electrical circuitry of the first electricalcontact and the second electrical contact.

A thermoelectric device 200 refers herein to a solid-state heat pumpthat may preferably operate on the Peltier effect. The semiconductordevice 250 preferably contains an array of p- and n-type semiconductorelements heavily doped with electrical carriers. This array is oftenelectrically connected in series and thermally connected in parallel andthen affixed to two ceramic substrates, the internal heat transferinterface 130 and the exterior heat transfer interface 132, one on eachside of the elements, as in FIGS. 1 to 3 and 14A and 14B. In FIGS. 1 to3 and 14A, the semiconductor device is shown with the number of N-typesemiconductor elements is the same as the number of P-type semiconductorelements. In FIG. 14B, the number of N-type semiconductor elements isdistinct from the number of P-type semiconductor elements. While FIG.14B shows more N-type semiconductor elements than P-type semiconductorelements, the invention also includes semiconductor devices with moreP-type semiconductor elements than N-type semiconductor elements.

Consider how the heat transfer occurs as electrons flow through one pairof n- and p-type elements, which is referred to herein as a couplewithin the thermoelectric device. Electrons can travel freely in theconductors, which are often made of copper, but not so freely in thesemiconductor. These conductors are labeled Cu in FIGS. 1 to 3. Thisdiscussion will now focus on FIG. 3, however, the discussion of FIG. 2basically reverses the sign of the voltage of the driving signal 160,reversing the flowing of holes and electrons, as well as the directionof heat transfer,

As the electrons leave the conductor Cu, they enter the hot side of theP-Type and must fill a hole in order to move through the P-Type. When anelectron fills a hole, it drops to a lower energy level, releasing heat.The holes in the P-Type move from the cold side to the hot side. As anelectron moves from the P-Type into the conductor Cu on the cold side,the electron moves to a higher energy level through absorbing heat. Theelectron moves freely through the conductor CU until reaching the coldside of the N-Type semiconductor. When the electron moves into theN-Type, it bumps up an energy level in order to move through thesemiconductor, absorbing heat. As the electron leaves the hot-side ofthe N-Type, it moves freely in the conductor Cu. It drops to a lowerenergy level releasing heat.

Heat is always absorbed at the cold side of the n- and p-type elements.The electrical charge carriers (holes in the P-Type; electrons in theN-Type) always travel from the cold side to the hot side, and heat isalways released at the hot side of a thermoelectric element. The heatpumping capacity of a thermoelectric device is proportional to thecurrent and dependent on the element geometry, number of couples, andmaterial properties.

As used herein, the Peltier effect is the phenomenon whereby the passageof an electrical current through a junction consisting of two dissimilarmetals results in a cooling effect. When the direction of current flowis reversed heating will occur.

A thermal transfer element 230 refers herein a device that is typicallythermally coupled to a heat transfer interface of a thermoelectricdevice 200, usually the exterior heat transfer interface 132, for heattransfers with the exterior 300 of the hard disk drive 10. It is used tofacilitate the transfer of heat between the thermoelectric device andthe exterior of the hard disk drive. The most common thermal transferelement is an aluminum plate that has fins attached to it, as shown inFIGS. 1 to 3, 7C and 8C. A fan 222 is used to move ambient air 150through the thermal transfer element to transfer heat. Another style ofthermal transfer element uses a plate with tubing embedded in it. Aliquid is sent through the tubing to pick up heat from thethermoelectric device.

The external cover 100 may further include a thermal controller 500receiving a temperature measure 510 of the internal thermal zone 20 andproviding a driving signal 160 to the electrical contact pair 210, asshown in FIG. 9A. Alternatively, the thermoelectric device 200 maypreferably include the thermal controller, as shown in FIG. 11A. Thethermal controller may include a means for applying the first potentialdifference 550 between the contact pair to enable the first heattransfer 120, and the means for applying the second potential difference552 between the contact pair to enable the second heat transfer 122, asshown in FIG. 10D. Preferably, the thermal controller forces the drivingsignal 160 toward the first potential difference V1 when the temperaturemeasure 510 is greater than a top operating temperature 512. Preferably,the thermal controller forces the driving signal toward the secondpotential difference V2, when the temperature measure is less than alower operating temperature 514.

The thermal controller 500 may include at least one of the following. Afinite state machine 502 generating a digital version 504 of the drivingsignal based upon the temperature measure 510 as in FIG. 9B. A computer520 accessibly coupled 522 to a memory 524 containing a program system600 including at least one program step generating a second digitalversion 526 of the driving signal based upon the temperature measure asin FIG. 9C. A neural network 530 responding 532 to the temperaturemeasure to generate a third digital version 534 of the driving signal,as in FIG. 9D. The thermal controller may further include exactly one ofthe finite state machine, the computer and the neural network, or acombination of these elements, such as a finite state machine and acomputer, two finite state machines, and so on.

As used herein, the computer 520 will include at least one instructionprocessor and at least one data processor. Each data processor will bedirected by at least one instruction processor. The computer may beimplemented in, or as, a Field Programmable Gate Array, gate array, anapplication specific integrated circuit, a digital signal processor,and/or a general-purpose microprocessor.

The memory 524 may include memory components that are non-volatilememories and/or volatile memories. Non-volatile memories tend to retaintheir memory contents without the application of external power, whereasvolatile memories tend to lose their memory contents without theapplication of external power. The memory may and often does containboth non-volatile memory components and volatile memory components.

The finite state machine 502 may be implemented by any combination of: alogic circuit, a programmable logic device, and/or a Field ProgrammableGate Array. The logic circuit may be implemented in a gate array and/oran application specific integrated circuit.

The neural network 530 may be implemented similarly to the finite statemachine 502, and include neurons, each with a neural state and couplingthrough weighted paths to other neurons. Upon the stimulus of thetemperature measure 510, the neural network responds by calculating thepath couplings, possibly changing the state of at least some of theneurons, and taking the weighted path response to generate the thirddigital version 534 of the driving signal.

The following figures include flowcharts of at least one method of theinvention possessing arrows with reference numbers. These arrows willsignify of flow of control and sometimes data, supportingimplementations including at least one program step or program threadexecuting upon a computer, inferential links in an inferential engine,state transitions in a finite state machine, and learned responseswithin a neural network.

The step of starting a flowchart refers to at least one of the followingand is denoted by an oval with the text “Start” in it. Entering asubroutine in a macro instruction sequence in a computer. Entering intoa deeper node of an inferential graph. Directing a state transition in afinite state machine, possibly while pushing a return state. Andtriggering at least one neuron in a neural network.

The step of termination in a flowchart refers to at least one of thefollowing and is denoted by an oval with the text “Exit” in it. Thecompletion of those steps, which may result in a subroutine return,traversal of a higher node in an inferential graph, popping of apreviously stored state in a finite state machine, return to dormancy ofthe firing neurons of the neural network.

A step in a flowchart refers to at least one of the following. Theinstruction processor responds to the step as a program step to controlthe data execution unit in at least partly implementing the step. Theinferential engine responds to the step as nodes and transitions withinan inferential graph based upon and modifying a inference database in atleast partly implementing the step. The neural network responds to thestep as stimulus in at least partly implementing the step. The finitestate machine responds to the step as at least one member of a finitestate collection comprising a state and a state transition, implementingat least part of the step.

Several flowcharts include multiple steps. In certain aspects, any oneof the steps may be found in an embodiment of the invention. In otheraspects, multiple steps are needed in an embodiment of the invention.When multiple steps are needed, these steps may be performedconcurrently, sequentially and/or in a combination of concurrent andsequential operations. The shapes of the arrows in multiple stepflowcharts may differ from one flowchart to another, and are not to beconstrued as having intrinsic meaning in interpreting the concurrency ofthe steps.

The program system 600 of FIG. 9C may implement a fuzzy logic controllergenerating the second digital version 526 of the driving signal basedupon the temperature measure 510, as shown in operation 602 of FIG. 10B.Typically, a fuzzy logic controller includes a list of at least twofuzzy inferences.

The program system 600 may include a program step implementing theneural network 530 responding 532 to the temperature measure 510 togenerate the third digital version 534 of the driving signal, as shownby operation 604 of FIG. 10C.

The thermal controller 500 may include an analog circuit 560 generatingthe driving signal 160 based upon at least one of the temperaturemeasure 510, the digital version 504 of the driving signal, the seconddigital version 526 of the driving signal, and the third digital version534 of the driving signal as shown in FIG. 10A. The analog circuit mayfurther generate the driving signal based upon exactly one of these.

The thermal controller 500 may further include the following:

-   -   A first means for forcing 554 the driving signal 160 toward the        first potential difference V1 between the electrical contact        pair 210 to enable the first heat transfer 120 when the        temperature measure 510 is above a top operating temperature        512.    -   And a second means for forcing 556 the driving signal toward the        second potential difference between the electrical contact pair,        when the temperature measure is below a lower operating        temperature 514.    -   FIG. 15A shows the first means and the second means included in        the thermal controller.    -   FIGS. 15B and 17A show the first means and the second means        included in the analog circuit 560. This represents a        predominantly analog circuit approach.    -   Alternatively, FIG. 15C shows the first means and the second        means included in the Finite State Machine 502, collectively        generating the digital version of the driving signal 504, within        the thermal controller. This is a predominantly digital logic        approach.    -   FIG. 15C shows the second digital version 526 of the driving        signal being presented to an Analog to Digital Converter 562 to        at least partly create the driving signal 160. The second        digital version of the driving signal is preferably generated by        the computer 520 shown in FIG. 9C. This is a predominantly        computer based approach.    -   FIG. 16A shows an alternative and a refinement to FIG. 15C,        where the digital version of the driving signal is presented to        the Analog to Digital Converter to create a first analog signal        version 564 of the driving signal, which is presented to the        first amplifier 566 to at least partly create the driving        signal.    -   FIG. 16B shows a further refinement of FIG. 16A. The analog to        digital converter provides a second analog signal version 570 to        an analog multiplier 572. A Voltage Controlled Oscillator 568        also provides an oscillating carrier signal 574 to the analog        multiplier. The analog multiplier provides a third analog signal        version 576 to the first amplifier to at least partly create the        driving signal.

Looking in greater detail at FIG. 17A, the temperature measure 510 isprovided to the first means 554 and to the second means 556 as in FIG.15B.

-   -   The first means includes a first differential amplifier 586-1,        to which the temperature measure is provided to the “+”        terminal, and the top operating temperature 512 is provided to        the “−” terminal to create the too hot signal 582.    -   The second means includes a second differential amplifier 586-2,        to which the temperature measure is provided to the “−”        terminal, and the bottom operating temperature 514 is provided        to the “+” terminal to create the too cold signal 584.    -   The voltage source 580 receives the too hot signal and the too        cold signal and uses them to create the driving voltage DV        provided to the pulse wave modulator 590.    -   When the temperature measure is above the top operating        temperature, the too hot signal is active.        -   When the too hot signal is active, the too cold signal is            preferably inactive.        -   The voltage source preferably provides the driving voltage            sufficient that the resulting driving signal forces the            contact pair 210 toward the first potential difference V1.    -   When the temperature measure is below the bottom operating        temperature, the too cold signal is active.        -   When the too cold signal is active, the too hot signal is            preferably inactive.        -   The voltage source preferably provides the driving voltage            sufficient that the resulting driving signal forces the            contact pair toward the second potential difference V2.    -   When the temperature measure is within normal operating        temperatures        -   The temperature means is not below the bottom operating            temperature, and the too cold signal is preferably inactive.        -   The temperature means is not above the top operating            temperature, and the too hot signal is preferably inactive.        -   Both the too cold signal and the too hot signal are            preferably inactive.        -   The voltage source preferably provides the driving voltage            sufficient that the resulting driving signal forces the            contact pair toward a low or zero potential difference.

The external cover 100 and alternatively, the thermoelectric device 200,may further include a second electrical contact pair 212 driving a fanmotor 220 powering a fan 222, as shown in FIG. 11E.

-   -   When powered, the fan moves air 150 across a thermal transfer        element 230 exterior 300 to the hard disk drive 10, as in FIG.        7A to 8C.    -   The thermal controller 500 may further provide a fan driving        signal 224 to the second electrical contact pair.    -   The thermal controller may preferably provide the fan driving        signal with at least one fan potential difference distinct from        zero volts, when the temperature measure is either greater than        the top operating temperature 512 or less than the bottom        operating temperature 514.    -   The fan driving signal may be at least temporarily a Direct        Current (DC) signal and/or an Alternating Current (AC) signal.

Manufacturing the thermoelectric device 200 may include providing themeans for enabling power 240 with a thermal coupling to the internalheat transfer interface 130 and with a thermal coupling to the exteriorheat transfer interface 132, and coupling the electrical contact pair210 to the means for enabling power 240.

-   -   The thermoelectric device is a product of this manufacturing        process.    -   Manufacturing the thermoelectric device may further include        electrically coupling the thermal controller 500 to the        electrical contact pair, and/or thermally coupling the thermal        transfer element 230 to the exterior heat transfer interface.

Manufacturing the thermal controller 500 may include at least one of thefollowing steps.

-   -   Providing the means for applying the first potential difference        550 and the means for applying the second potential difference        552 to at least partly create the thermal controller.    -   Providing        -   a first means 554 for forcing the driving signal 160 toward            the first potential difference V1 between the electrical            contact pair 210, when a temperature measure 510 is above a            top operating temperature 512 and        -   a second means 556 for forcing the driving signal toward the            second potential difference V2 between the electrical            contact pair, when the temperature measure is below a lower            operating temperature 514        -   to at least partly create the thermal controller.    -   Providing at least one finite state machine 502 generating a        digital version 504 of the driving signal to at least partly        create the thermal controller.    -   Providing at least one computer 520 generating a second digital        version 526 of the driving signal to at least partly create the        thermal controller.    -   Providing a neural network generating 530 a third digital        version 534 of the driving signal to at least partly create the        thermal controller.    -   Providing the program system 600 in the memory 524 to at least        partly create the thermal controller.    -   And/or providing an analog circuit 560 to at least partly create        the thermal controller.

Manufacture of the external cover 100 may include at least one of thefollowing.

-   -   Die-stamping 700 a sheet of metal 702 to at least partly create        the external cover including the intermediate thermal transfer        interface 110.    -   Molding 710 molten metal 712 to at least partly create the        external cover including the transfer interface.    -   The sheet of metal may preferably include a form of sheet        stainless steel.    -   The molten metal may include a form of molten aluminum.    -   The invention includes the external cover as a product of this        process.

The manufacture of the external cover 100 may further includethermal-coupling a thermoelectric device 200 via the intermediatethermal transfer interface 110 to its internal heat transfer interface130.

-   -   Such external covers are shown in FIGS. 1 to 3, and may be        preferred for use in a system employing shared fans and fan        motors.    -   Further, a thermal transfer element 230 may be thermally-coupled        to the exterior heat transfer interface 132.    -   A fan motor 220 and fan 222 may further be positioned near the        thermal transfer element 230, as shown in FIGS. 7A to 8C.

Manufacture of the hard disk drive 10 may include at least one of thefollowing:

-   -   Providing the thermal controller 500 and the thermoelectric        device 200.    -   And electrically coupling the thermal controller via the        electrical contact pair 210 to the thermoelectric device to        create the hard disk drive.    -   The hard disk drive is a product of this manufacturing process.    -   These steps may be implemented by providing the thermoelectric        device including the thermal controller.    -   Alternatively, the external cover 100 may include the        thermoelectric device and possibly further include the thermal        controller electrically coupled via the electrical contact pair,        so that providing the external cover implements one or both of        the above steps.

The manufacturing process for the hard disk drive 10 may further includeat least one of the following.

-   -   Using a disk cover 16 as the external cover 100 as shown in        FIGS. 6 to 7C to create the hard disk drive.    -   Using a disk base 14 as the external cover, as shown in FIGS. 5        and 8A to 8C, to create the hard disk drive.    -   The manufacturing may include using both the disk cover and the        disk base as external covers for the hard disk drive.

The external cover 100 and the hard disk drive 10 operate as follows.

-   -   While these operations may be implemented in a variety of        fashions, to simplify their discussion, they will be discussed        as implemented through operations performed by the program        system 600.    -   The thermoelectric device 200 enables a first heat transfer 120        from the internal thermal zone 20 via the intermediate thermal        transfer interface 110 to the exterior 300 of the hard disk        drive 10 as shown in FIG. 2.    -   The thermoelectric devices also enables a second heat transfer        122 from the exterior of the hard disk drive via the transfer        interface to the internal thermal zone, as shown in FIG. 3.    -   Operation 610 of FIG. 11B supports enabling the first heat        transfer and operation 612 supports enabling the second heat        transfer.

The thermoelectric device 200 may preferably include the thermalcontroller 500 electrically coupling with the electrical contact pair210 to the means for enabling power 240 as shown in FIG. 11A. The meansfor enabling power may further preferably include the electrical contactpair coupling with the semiconductor device 250 through the firstsemiconductor terminal 252-1 and the second semiconductor terminal252-2.

A driving signal 160 may preferably be provided to the electricalcontact pair 210 to enable the first heat transfer 130 as in operation620 of FIG. 11C, the second heat transfer 132 as in operation 620 ofFIG. 11C, or essentially no-heat transfer as shown in operation 614 ofFIG. 11B. Essentially no-heat transfer refers herein to the thermaltransfer condition when no power is being expended through theelectrical contact pair.

Providing the driving signal 160 may preferably include forcing thedriving signal toward the first potential difference V1 to enable thefirst heat transfer 120 as in operation 630 of FIG. 12A, and forcing thedriving signal toward the second potential difference V2 to enable thesecond heat transfer 122 as in operation 632 in operation 12B.

A temperature measure 510 may preferably be determined for the internalthermal zone 20. Forcing the driving signal 160 toward the firstpotential difference V1 may preferably occur when the temperaturemeasure is greater than a top operating temperature 512 as in operation640 of FIG. 12C. Forcing the driving signal toward the second potentialdifference V2 may preferably occur when the temperature measure is lessthan the bottom operating temperature 514 as in operation 642 of FIG.12D. In certain embodiments, the test for when may include equality, sothat forcing the driving signal toward the first potential differencemay occur when the temperature measure is greater than or equal to thetop operating temperature.

Pulse-width-modulation may be employed.

-   -   Forcing the driving signal 160 toward the first potential        difference V1 may preferably include pulse-width-modulating the        driving signal between the first potential difference and zero        volts, preferably based upon the temperature measure 510, as in        operation 650 of FIG. 12E.    -   Forcing the driving signal toward the second potential        difference V2 may preferably include pulse-width-modulating the        driving signal between the second potential difference and zero        volts, preferably based upon the temperature measure, as in        operation 652 of FIG. 12F.

The invention includes the hard disk drive 10, including thethermoelectric device 200 providing the internal heat transfer interface130 thermal-coupling to the internal thermal zone 20 and the exteriorheat transfer interface 132 thermal-coupling with an exterior 300 of thehard disk drive.

The invention may preferably include the hard disk drive 10, containingthe external cover 100 providing the intermediate thermal transferinterface 110 thermal-coupling to the internal thermal zone 20. The harddisk drive may further include the thermoelectric device 200thermal-coupling to the transfer interface and to an exterior heattransfer interface 132 for heat transfers with an exterior 300 of thehard disk drive.

The invention includes a system 790 using at least one of the hard diskdrive 10 as shown in FIG. 13A.

-   -   The system may include a thermal conduit 310 thermal-coupling to        the exterior 300 of the hard disk drive as shown in FIG. 13B.    -   These systems include, but are not limited to, a Redundant        Arrays of Inexpensive Disks 800 (RAID) as in FIG. 13C, a server        computer 810 as in FIG. 13D, a desktop computer 820 as in FIG.        13E, and a notebook computer 830 as in FIG. 13F.

The invention includes manufacturing the system 790, including providingthe hard disk drive 10 of the invention.

-   -   The manufacturing process may further include thermal coupling        the thermal conduit 310 to the hard disk drive.    -   The system is the product of the manufacturing process.

The hard disk drive with both its disk base 14 and disk cover 16, eachacting as an external cover 100, each possessing a intermediate thermaltransfer interface 110, may be preferred in a system 790 supportingmultiple hard disk drives, such as a RAID 800, because adjacent pairs ofhard disk drives may share a thermal conduit 310, as shown in FIG. 13G.The manufacturing process may further include

-   -   Using a second hard disk drive 10-2.    -   Thermal coupling the thermal conduit to the disk base of the        hard disk drive.    -   And thermal coupling the disk cover of the second hard disk        drive.

Alternatively, the system 790 may include one hard disk drive 10 withthe disk base 14 as the external cover 100, and a second hard disk drive10-2 with the disk cover 16 as its external cover, as shown in FIG. 17B.Such embodiments of the system are also useful when supporting multiplehard disk drives, such as a RAID 800, also allowing adjacent pairs ofhard disk drives to share the thermal conduit 310. The manufacturingprocess is similar:

-   -   Using the hard disk drive.    -   Using the second hard disk drive.    -   Thermal coupling the thermal conduit to the disk base of the        hard disk drive.    -   And thermal coupling the thermal conduit to the disk cover of        the second hard disk drive.

Alternatively, the system 790 may include only the hard disk drive 10using the disk base 14 as the external cover 100, as shown in FIG. 13H.Manufacturing this systems using this hard disk drive may preferablyinclude:

-   -   Using the hard disk drive.    -   And thermal coupling the thermal conduit to the disk base of the        hard disk drive.

Another alternative, the system 790 may include only the hard disk drive10 using the disk cover 16 as the external cover 100, as shown in FIG.13I. Manufacturing this systems using this hard disk drive maypreferably include:

-   -   Using the second hard disk drive.    -   And thermal coupling the thermal conduit to the disk cover of        the second hard disk drive.

The preceding embodiments provide examples of the invention and are notmeant to constrain the scope of the following claims.

1. A method of controlling a thermoelectric device to affect atemperature of an internal thermal zone in a hard disk drive, comprisingthe steps: applying a first potential difference between an electricalcontact pair to enable a first heat transfer from an internal heattransfer interface included in a thermal interface to an exterior heattransfer interface thermally coupling to the exterior of said hard diskdrive; wherein said thermal interface is thermally coupled to saidinternal thermal zone of said hard disk drive; and applying a secondpotential difference between said electrical contact pair to enable asecond heat transfer from said exterior heat transfer interface to saidinternal heat transfer interface; wherein a sign of said first potentialdifference is an opposite of the sign of said second potentialdifference; wherein the step applying said first potential difference,comprises the step: forcing a driving signal toward said first potentialdifference between said electrical contact pair; and wherein the stepapplying said second potential difference, comprises the step: forcingsaid driving signal toward said second potential difference between saidelectrical contact pair.
 2. The first heat transfer and said second heattransfer, as products of the process of claim
 1. 3. The method of claim1, wherein the step applying said first potential difference, furthercomprises the step: pulse-width-modulating said driving signal towardsaid first potential difference between said electrical contact pair;and wherein the step applying said second potential difference, furthercomprises the step: pulse-width-modulating said driving signal towardsaid second potential difference between said electrical contact pair.4. The method of claim 1, further comprising the step: receiving atemperature measure of said internal thermal zone; wherein step applyingsaid first potential difference, further comprises the step: forcingsaid driving signal toward said first potential difference between saidelectrical contact pair, when said temperature measure is above a topoperating temperature; and wherein step applying said second potentialdifference, further comprises the step: forcing said driving signaltoward said second potential difference between said electrical contactpair, when said temperature measure is below a lower operatingtemperature.
 5. A thermal controller implementing the method of claim 1,comprising: means for applying said first potential difference betweensaid electrical contact pair to enable said first heat transfer fromsaid internal heat transfer interface to said exterior heat transferinterface; and means for applying said second potential differencebetween said electrical contact pair to enable said second heat transferfrom said exterior heat transfer interface to said internal heattransfer interface.
 6. The thermal controller of claim 5, wherein saidthermal controller receives a temperature measure of said internalthermal zone to create a driving signal; wherein the means for applyingsaid first potential difference, comprises: first means for forcing saiddriving signal toward said first potential difference between saidelectrical contact pair, when said temperature measure is above a topoperating temperature; and wherein the means for applying said secondpotential difference, comprises: second means for forcing said drivingsignal toward said second potential difference between said electricalcontact pair, when said temperature measure is below a lower operatingtemperature.
 7. The thermal controller of claim 5, comprising at leastone member of the group consisting of: at least one finite state machinegenerating a digital version of said driving signal; at least onecomputer generating a second digital version of said driving signal; aneural network generating a third digital version of said drivingsignal; wherein said computer is accessibly coupled to a memory anddirected by a program system including at least one program stepresiding in said memory; wherein said computer includes at least oneinstruction processor and at least one data processor; wherein for eachof said data processors, said data processor is directed by at least oneof said instruction processors.
 8. The thermal controller of claim 7,wherein said finite state machine, further comprises: said finite statemachine generating said digital version of said driving signal basedupon a temperature measure of said internal thermal zone; wherein saidcomputer, further comprises: said computer generating said second ofsaid digital versions of said driving signal based upon said temperaturemeasure; and wherein said neural network, further comprises: said neuralnetwork generating said third of said digital versions of said drivingsignal based upon said temperature measure.
 9. The thermal controller ofclaim 7, wherein said program system includes at least one of theprogram steps: forcing said second digital version of said drivingsignal toward said first potential difference; and forcing said seconddigital version of said driving signal toward said second potentialdifference.
 10. The thermal controller of claim 9, wherein the programstep forcing said second digital version of said driving signal towardsaid first potential difference, further comprises the program step:pulse-width-modulating said second digital version of said drivingsignal toward said first potential difference; and wherein the programstep forcing said second digital version of said driving signal towardsaid second potential difference, further comprises the program step:pulse-width-modulating said second digital version of said drivingsignal toward said second potential difference.
 11. The thermalcontroller of claim 8, further comprising: an analog circuit receivingat least one member of the analog input group to create said drivingsignal; wherein said analog input group, consists of: said temperaturemeasure, said digital version of said driving signal, said seconddigital version of said driving signal, and said third digital versionof said driving signal.
 12. The thermal controller of claim 6, furthercomprising: an analog circuit receiving a temperature measure to createsaid driving signal, comprising: means for forcing said driving signaltoward said first potential difference between said electrical contactpair, when said temperature measure is above said top operatingtemperature; and means for forcing said driving signal toward saidsecond potential difference between said electrical contact pair, whensaid temperature measure is below said lower operating temperature. 13.The thermal controller of claim 12, wherein said analog circuit, furthercomprising at least one instance of the group consisting of: a Digitalto Analog Converter (DAC); an amplifier; and a voltage switcher.
 14. Amethod of manufacturing said thermal controller of claim 5, comprisingat least one step of the group consisting of the steps: providing saidmeans for applying said first potential difference and said means forapplying said second potential difference to at least partly create saidthermal controller; providing a means for forcing a driving signaltoward said first potential difference between said electrical contactpair, when a temperature measure is above a top operating temperature, ameans for forcing said driving signal toward said second potentialdifference between said electrical contact pair, when said temperaturemeasure is below a lower operating temperature to at least partly createsaid thermal controller; providing at least one finite state machinegenerating a digital version of said driving signal to at least partlycreate said thermal controller; providing at least one computergenerating a second digital version of said driving signal to at leastpartly create said thermal controller; providing a neural networkgenerating a third digital version of said driving signal to at leastpartly create said thermal controller; wherein said computer isaccessibly coupled to a memory and directed by a program systemincluding at least one program step residing in said memory; providingsaid program system in said memory to at least partly create saidthermal controller; providing an analog circuit to at least partlycreate said thermal controller; wherein said analog circuit receives atleast one member of the analog input group to create said drivingsignal; wherein said analog input group, consists of: said temperaturemeasure, said digital version of said driving signal, said seconddigital version of said driving signal, and said third digital versionof said driving signal.
 15. The thermal controller as a product of theprocess of claim
 14. 16. A thermoelectric device electrically couplingthrough said electrical contact pair to said thermal controller of claim5 to enable said first heat transfer and said second heat transfer, andcomprising: said internal heat transfer interface; said exterior heattransfer interface; and means for enabling power from said electricalcontact pair for said first thermal transfer and for said second thermaltransfer.
 17. An external cover for said hard disk drive of claim 5,comprising: said thermal controller providing said driving signal tosaid electrical contact pair to direct a thermoelectric device in saidfirst heat transfer and in said second heat transfer; wherein saidthermoelectric device, comprises: said internal heat transfer interfaceincluded in said thermal interface for thermal-coupling to said internalthermal zone; and said exterior heat transfer interface forthermal-coupling to said exterior of said hard disk drive.
 18. The harddisk drive of claim 5, comprising: said thermal controller providingsaid driving signal to said electrical contact pair to direct athermoelectric device in said first heat transfer and in said secondheat transfer; wherein said thermoelectric device, comprises: saidinternal heat transfer interface included in said thermal interfacethermal-coupling to said internal thermal zone; and said exterior heattransfer interface thermal-coupling to said exterior of said hard diskdrive.
 19. A system, comprising: at least one of said hard disk drivesof claim
 18. 20. The system of claim 19, further comprising: a thermalconduit thermal-coupling to said exterior of said hard disk drive. 21.The system of claim 19, wherein said system acts as at least one of aRedundant Array of Inexpensive Disks (RAID), a server computer, adesktop computer, and a notebook computer.